PLA Blister film(High Gloss & Clarity) – Keyful PLA-SAP
•Derived from renewable corn, certified for industrial composting.
•High transparency
•Printable, compatible with UV and screen printing
•Alternative to APET blister sheet
Keyful PLA-SAP offers a highly transparent, printable, and customizable PLA blister film solution. Utilizing renewable resources and an industrial composting pathway, it helps clients in the market balance packaging aesthetics with sustainability goals. Surface treatment enhances compatibility with UV/screen printing, while a controlled 250μm thickness with tight tolerances facilitates consistent die-cutting and thermoforming for reliable high-volume delivery.
We focus on the research & development, production, manufacturing, and supply of various flexible, environmentally friendly, and biodegradable packaging films, covering BOPP, BOPET, BOPA, PE, and recyclable single-material films, and are committed to meeting the diverse packaging solution needs of the market.
Keyful PLA-SAP’s PLA blister film / PLA blister sheet utilizes a renewable corn-based system and is designed with an industrial composting certification route, offering a more environmentally friendly alternative to biodegradable PLA blister film / compostable PLA blister film needs.
The film surface maintains high transparency, facilitating visual inspection after forming and is treated with corona/surface tension (38 dyn/cm), providing a printable surface compatible with UV and screen printing, and is a common process replacement for APET blister sheet. The material is 250μm thick (±5%), with a tensile strength of 46MPa.

Applications
- Used in packaging industries requiring blister forming, such as toys, health supplements, and similar products.
- Suitable for outer packaging requiring clarity and print readability (barcodes/patterns/UV information)
- Ideal for customers with high sustainability requirements: replaces APET, guiding the supply chain towards biodegradable blister film PLA
- Can be used as an upstream material for mass customization in die-cutting/lamination/bonding, supporting mold shape development and process matching
Technical Properties (Typical Values)
| Properties | Units | Result | Test method |
|---|---|---|---|
| Thickness | microns | 250 | DIN 53 370 |
| Thickness Var. (±) | % | ±5% | ASTM D-374-C |
| Treatment (Corona / Surface Tension) | dyne/cm | 38 | ASTM D-2578 |
| Tensile Strength | MPa | 46 | GB/T 1040.2-2006 |
| Elongation | % | 6 | GB/T 1040.2-2006 |
| Vicat Softening Temperature (VST) | °C | 56 | GB/T 8802-2001 |
All properties are tested under standard laboratory conditions: 23±2ºC; 50±5% RH, unless otherwise stated. Where relevant, tests are based on international testing standards. Metallising is conducted by a sub-contractor. MD – Machine Direction TD – Transverse Direction.






